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    [CFP] [Extended Deadline: Abstract- Mar. 6 & Paper- Mar. 13 ] ISLPED 2017 (http://www.islped.org)

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    Deadline: March 06, 2017 | Date: July 24, 2017-July 26, 2017

    Venue/Country: Taiwan

    Updated: 2017-03-01 16:21:08 (GMT+9)

    Call For Papers - CFP

    IEEE/ACM INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN

    Location: Taipei, Taiwan

    Date: July 24-26, 2017

    Abstract registration by Mar. 6, 2017, at 11:59pm PST

    Full paper due by Mar. 13, 2017, at 11:59pm PST

    Notification of paper acceptance: May 3, 2017

    Camera-ready version due: June 1, 2017

    The International Symposium on Low Power Electronics and Design (ISLPED) is the premier forum for presentation of innovative research in all aspects of low power electronics and design, ranging from process technologies and analog/digital circuits, simulation and synthesis tools, system-level design and optimization, to system software and applications. Specific topics include, but are not limited to, the following three main tracks and sub-areas:

    1. Technology, Circuits, and Architecture

    1.1. Technologies

    1.2. Circuits

    1.3. Logic and Architecture

    2. CAD, system, and software

    2.1. CAD Tools and Methodologies

    2.2. Systems and Platforms

    2.3. Software and Applications

    3. Industrial Design Track

    Submissions should be full-length papers of up to 6 pages (PDF format, double-column, US letter size, using the ACM Conference format, available at http://www.acm.org/publications/article-templates/proceedings-template.html including all illustrations, tables, references, and an abstract of no more than 250 words. Submissions must be anonymous. Submissions exceeding 6 pages or identifying the authors, either directly or through explicit references to their prior work, will be automatically rejected. More information about paper submission can be found at http://www.islped.org.

    ORGANIZING COMMITTEE:

    General Co-Chairs

    Chia-Lin Yang, NTU

    yangcatcsie.ntu.edu.tw

    David Garrett, Broadcom

    garrettdatbroadcom.com

    Program Co-Chairs

    Thomas Wenisch, Univ. Michigan

    twenischatumich.edu

    Jaydeep Kulkarni, Intel

    jaydeep.p.kulkarniatintel.com

    Publicity Co-Chairs

    Jae-Joon Kim, POSTECH

    jaejoonatpostech.ac.kr

    Umit Ogras, ASU

    umitatasu.edu

    Treasurer

    Yi-Jung Chen, NCNU

    yjchenatncnu.edu.tw

    Web Chair

    Hsiang-Yun Cheng, Sinica

    hychengatciti.sinica.edu.tw

    Industry Liaisons

    John Redmond, Broadcom

    jcredmonatbroadcom.com

    Tai-Cheng Lee, NTU

    tleeatntu.edu.tw

    Tsung-Yi Ho, NTHU

    tyhoatcs.nthu.edu.tw

    Publication Chair

    Iris Hui-Ru Jiang, NCTU

    huiru.jiangatgmail.com

    Local Arrangement Co-Chairs

    Pi-Cheng Hsiu, Sinica

    pchsiuatiis.sinica.edu.tw

    Yuan-Hao Chang, Sinica

    johnsonatiis.sinica.edu.tw

    Registration Chair

    Tsung-Te Liu, NTU

    ttliuatntu.edu.tw

    Design Contest Co-Chairs

    Saibal Mukhopadhyay, Georgia Tech

    saibalatece.gatech.edu

    Yongpan Liu, NTHU

    ypliuattsinghua.edu.cn


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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