TERAHERTZ - TSP 2017 - 1st International Workshop of Advanced Terahertz Technologies and Applications (AT2P) | IEEE R8 | IEEE Xplore® | SCOPUS
Website http://tsp.vutbr.cz/?page_id=2744#WS3-17 |
Category plasmonic Terahertz sources; receivers; photoconductive antennas; photomixers; Terahertz photonic processing; THz; MMW sources; laser driven terahertz sources; quantum cascade lasers; QCLs; resonant tunneling diode; RTD; heterojunction bipolar transistors; Terahertz instruments; antennas; Terahertz imaging systems for security; spectroscopy; ultra high speed MMW digital device; submillimeter-wave radar; astronomy; environmental science; imaging and remote sensing
Deadline: March 14, 2017 | Date: July 05, 2017-July 07, 2017
Venue/Country: Barcelona, Spain
Updated: 2017-03-09 21:57:33 (GMT+9)
Call For Papers - CFP*** 1st International Workshop of Advanced Terahertz Technologies and Applications (AT2P) ***Co-located with 2017 40th International Conference on Telecommunications and Signal Processing (TSP)July 5-7, 2017, Barcelona, Spainhttp://tsp.vutbr.cz/Technically co-sponsored by IEEE Region 8, EEE Spain Section, IEEE Czechoslovakia Section, IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, and IEEE Croatia Section Communications Chapter.The TSP 2017 Proceedings, containing presented papers at the Conference, will be sent for indexing in the IEEE Xplore® Digital Library registered under IEEE Conference Record #41294, SCOPUS, Conference Proceedings Citation Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases.Authors of the best rated and presented papers will be invited for publishing in special issues of international journals.GENERAL INFORMATION:Lying between microwave and infrared spectrum, terahertz band is an attractive part of electromagnetic spectrum for space, imaging, spectroscopy and now communication applications. In order to increase the performance of the terahertz systems, efficient transmitter and receiver designs, and terahertz signal processing are key points. Within the framework of the 2017 40th International Conference on Telecommunications and Signal Processing (TSP - http://tsp.vutbr.cz/), which will be held on July 5-7, 2017, in Barcelona, Spain, we invite you to contribute by presenting your research and sharing your knowledge on the cutting edge Terahertz Technologies. Topics of interest include, but are not limited to, the following: - Plasmonic Terahertz sources & receivers - Photoconductive antennas and photomixers- Terahertz photonic processing- IR, THz, and MMW sources and novel generation schemes- Laser driven terahertz sources- Quantum cascade lasers (QCLs)- Resonant tunneling diode (RTD) based terahertz sources and detectors- Heterojunction bipolar transistors (HBT) based terahertz sources and detectors- Terahertz instruments, devices and components- THz and MMW systems, transmission lines and antennas- Terahertz imaging systems for security applications- IR, THz, and MMW spectroscopy and material properties- Ultra high speed MMW digital devices- MMW and submillimeter-wave radar and communications- IR, THz and MMW astronomy and environmental science- IR, THz, and MMW imaging and remote sensingFor more details please visit the Conference website at http://tsp.vutbr.cz/?page_id=2744#WS3-17.EDITORIAL BOARD: - Prof. Lluis Jofre — Universitat Politècnica de Catalunya, Spain — Editor-in-Chief (E-mail: firstname.lastname@example.org) - Asst. Prof. Dr. Ayhan Yazgan — Karadeniz Technical University, Trabzon, Turkey (E-mail: email@example.com)- Asst. Prof. Dr. Mehmet Unlu — Ankara Yıldırım Beyazıt University, Ankara, Turkey (E-mail: firstname.lastname@example.org)STUDENT BEST PAPER AWARD:In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, to recognize outstanding technical contributions by students, as evidenced by the quality of papers, their presentations, and their technical excellence, the authors of the Best 3 Student Papers will be awarded during the conference by the Technical Committee. The Best Student Paper Award consists in a Certificate of Appreciation Plaque and an IEEE Student or IEEE Graduate Student membership for 2018. CONFERENCE ORGANIZERS: The TSP 2017 is IEEE technically co-sponsored Conference organized in cooperation with sixteen universities: - Brno University of Technology, Department of Telecommunications, Brno, Czech Republic- Budapest University of Technology and Economics, Department of Telecommunications and Media Informatics, Budapest, Hungary- Czech Technical University in Prague, Department of Telecommunication Engineering, Prague, Czech Republic- Isik University, Department of Electrical and Electronics Engineering, Sile/Istanbul, Turkey- Istanbul Technical University, Electronics and Communication Engineering Department, Istanbul, Turkey- Karadeniz Technical University, Department of Electrical and Electronics Engineering, Trabzon, Turkey- National Taiwan University of Science and Technology, Department of Electronic and Computer Engineering, Taipei, Taiwan- Seikei University, Graduate School and Faculty of Science and Technology, Information Networking Laboratory, Tokyo, Japan- Slovak University of Technology, Institute of Telecommunications, Bratislava, Slovak Republic- Tecnocampus, Escola Universitaria Politecnica de Mataro, Mataro, Spain- Technical University of Sofia, Faculty of Telecommunications, Sofia, Bulgaria- Universite Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancee de Saint-Denis (LIASD), France- University of Ljubljana, Laboratory for Telecommunications, Ljubljana, Slovenia- University of Osijek, Faculty of Electrical Engineering, Computer Science and Information Technology Osijek, Croatia- VSB - Technical University of Ostrava, Department of Telecommunications, Ostrava, Czech Republic- West Pomeranian University of Technology, Faculty of Electrical Engineering, Szczecin, PolandIMPORTANT DATES:Full Paper Submission: March 14, 2017 - 2PM CET (Final Extended Deadline)Notification of Paper Acceptance: April 14, 2017 Final Paper Submission: April 28, 2017 Authors' Early Registration and Payment: May 14, 2017 Authors' Late Registration and Payment: May 24, 2017 Listeners' Registration: July 5, 2017CONTACTS: Web: http://tsp.vutbr.cz/ E-mail: email@example.com Follow us on:- Facebook https://www.facebook.com/tspconf - Twitter https://twitter.com/tspconf TSP Organizers reserve the right to exclude a paper from distribution after the Conference (e.g., non-indexing in IEEE Xplore® and other databases) if the paper is not presented at the Conference. However, this paper will be distributed as part of the Conference proceedings issued on an USB drive.
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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