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BIOMETRICS - TSP 2017 - 1st International Workshop on Recent Advances in Biometrics and its Applications | 2017 40th International Conference on Telecommunications and Signal Processing (TSP) | IEEE R8 | IEEE Xplore®

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Website http://tsp.vutbr.cz/?page_id=2744#WS2-17 | Edit Freely

Category biometric recognition; finger; palmprint; face; eye; ear; iris; retina; gait; handwriting; voice; biometric image processing; feature extraction and matching; machine learning; techniques in biometrics; pattern recognition; soft biometrics; multimodal biometrics; online biometric systems; embedded biometric systems; applications

Deadline: March 14, 2017 | Date: July 05, 2017-July 07, 2017

Venue/Country: Barcelona, Spain

Updated: 2017-03-09 21:58:22 (GMT+9)

Call For Papers - CFP

*** 1st International Workshop on Recent Advances in Biometrics and its Applications ***

Co-located with 2017 40th International Conference on Telecommunications and Signal Processing (TSP)

July 5-7, 2017, Barcelona, Spain

http://tsp.vutbr.cz/

Technically co-sponsored by IEEE Region 8, EEE Spain Section, IEEE Czechoslovakia Section, IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, and IEEE Croatia Section Communications Chapter.

The TSP 2017 Proceedings, containing presented papers at the Conference, will be sent for indexing in the IEEE Xplore® Digital Library registered under IEEE Conference Record #41294, SCOPUS, Conference Proceedings Citation Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases.

Authors of the best rated and presented papers will be invited for publishing in special issues of international journals.

GENERAL INFORMATION:

Within the framework of the 2017 40th International Conference on Telecommunications and Signal Processing (TSP - http://tsp.vutbr.cz/), which will be held on July 5-7, 2017, in Barcelona, Spain, we invite you to the 1st International Workshop on Recent Advances in Biometrics and its Applications organized by LIASD Laboratory of the University of Paris 8. The goal of this workshop is to present and discuss the recent fundamental and applied research works providing novel solutions to challenging problems in biometrics. It is a great opportunity to bring researchers and experts together to discuss the current and future state of biometrics and possible areas of further cooperation. Topics of interest include, but are not limited to, the following:

- Biometric recognition (finger, palmprint, face, eye, ear, iris, retina, gait, handwriting, voice, etc.)

- Biometric image processing, feature extraction and matching

- Signal processing and machine learning techniques in biometrics

- Pattern recognition for biometrics

- Soft biometrics

- Multimodal biometrics

- Online biometric systems

- Embedded biometric systems

- Related applications

For more details please visit the Conference website at http://tsp.vutbr.cz/?page_id=2744#WS2-17.

EDITORIAL BOARD:

- Assoc. Prof. Larbi Boubchir — LIASD – University of Paris 8, France — Editor-in-Chief (E-mail: larbi.boubchir@ai.univ-paris8.fr)

- Prof. Boubaker Daachi — LIASD – University of Paris 8, France (E-mail: bd@ai.univ-paris8.fr)

STUDENT BEST PAPER AWARD:

In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, to recognize outstanding technical contributions by students, as evidenced by the quality of papers, their presentations, and their technical excellence, the authors of the Best 3 Student Papers will be awarded during the conference by the Technical Committee. The Best Student Paper Award consists in a Certificate of Appreciation Plaque and an IEEE Student or IEEE Graduate Student membership for 2018.

CONFERENCE ORGANIZERS:

The TSP 2017 is IEEE technically co-sponsored Conference organized in cooperation with sixteen universities:

- Brno University of Technology, Department of Telecommunications, Brno, Czech Republic

- Budapest University of Technology and Economics, Department of Telecommunications and Media Informatics, Budapest, Hungary

- Czech Technical University in Prague, Department of Telecommunication Engineering, Prague, Czech Republic

- Isik University, Department of Electrical and Electronics Engineering, Sile/Istanbul, Turkey

- Istanbul Technical University, Electronics and Communication Engineering Department, Istanbul, Turkey

- Karadeniz Technical University, Department of Electrical and Electronics Engineering, Trabzon, Turkey

- National Taiwan University of Science and Technology, Department of Electronic and Computer Engineering, Taipei, Taiwan

- Seikei University, Graduate School and Faculty of Science and Technology, Information Networking Laboratory, Tokyo, Japan

- Slovak University of Technology, Institute of Telecommunications, Bratislava, Slovak Republic

- Tecnocampus, Escola Universitaria Politecnica de Mataro, Mataro, Spain

- Technical University of Sofia, Faculty of Telecommunications, Sofia, Bulgaria

- Universite Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancee de Saint-Denis (LIASD), France

- University of Ljubljana, Laboratory for Telecommunications, Ljubljana, Slovenia

- University of Osijek, Faculty of Electrical Engineering, Computer Science and Information Technology Osijek, Croatia

- VSB - Technical University of Ostrava, Department of Telecommunications, Ostrava, Czech Republic

- West Pomeranian University of Technology, Faculty of Electrical Engineering, Szczecin, Poland

IMPORTANT DATES:

Full Paper Submission: March 14, 2017 - 2PM CET (Final Extended Deadline)

Notification of Paper Acceptance: April 14, 2017

Final Paper Submission: April 28, 2017

Authors' Early Registration and Payment: May 14, 2017

Authors' Late Registration and Payment: May 24, 2017

Listeners' Registration: July 5, 2017

CONTACTS:

Web: http://tsp.vutbr.cz/

E-mail: tsp@feec.vutbr.cz

Follow us on:

- Facebook https://www.facebook.com/tspconf

- Twitter https://twitter.com/tspconf

TSP Organizers reserve the right to exclude a paper from distribution after the Conference (e.g., non-indexing in IEEE Xplore® and other databases) if the paper is not presented at the Conference. However, this paper will be distributed as part of the Conference proceedings issued on an USB drive.


Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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