IMAGEPROC - TSP 2017 - Image Processing to Diagnose, Monitor, and Control Special Session on 2017 40th International Conference on Telecommunications and Signal Processing (TSP) | IEEE R8 | IEEE Xplore®
Website http://tsp.vutbr.cz/?page_id=2744#SS1-17 |
Category Information Systems; Network Services; Network Technologies; Telecommunication Systems; Modelling, Simulation and Measurement; Analog Signal Processing; Audio, Speech and Language Processing; Biomedical Signal Processing; Digital Signal Processing; Image and Video Signal Processing
Deadline: March 14, 2017 | Date: July 05, 2017-July 07, 2017
Venue/Country: Barcelona, Spain
Updated: 2017-03-09 21:58:39 (GMT+9)
Call For Papers - CFP*** Special Session on Image Processing to Diagnose, Monitor, and Control *** Co-located with 2017 40th International Conference on Telecommunications and Signal Processing (TSP)July 5-7, 2017, Barcelona, SpainWeb: http://tsp.vutbr.cz/Technically co-sponsored by IEEE Region 8, EEE Spain Section, IEEE Czechoslovakia Section, IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, and IEEE Croatia Section Communications Chapter.The TSP 2017 Proceedings, containing presented papers at the Conference, will be sent for indexing in the IEEE Xplore® Digital Library registered under IEEE Conference Record #41294, SCOPUS, Conference Proceedings Citation Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases.GENERAL INFORMATION:Within the framework of the 2017 40th International Conference on Telecommunications and Signal Processing (TSP - http://tsp.vutbr.cz ) held during July 5-7, 2017, Barcelona, Spain, we invite the researchers and practitioners to present and discuss advances in the research and development of intelligent systems for complex image processing and interpretation, based on efficient feature selection in the field of diagnosis, monitoring and control. Hence, the goal of this special session is to bring together researchers, engineers and users in different domains which are engaged in resolving their problems by the aid of intelligent image processing algorithms and with interest in novel methods, techniques and algorithms for intelligent image processing proposed to solve difficult problems in the mentioned field. Topics of interest include, but are not limited to, the following:- Criteria for feature selection- Image processing for real time control- Neural networks for image processing- Traffic control based on images- Medical diagnostic systems based on complex image processing- Assistive technologies based on image processing- UAV and robot guidance based on image interpretation- Quality control based on image processing- Fractal analysis- Texture analysis- Parallel processing of images- Image processing and Internet of Things- Image processing and cloud computingFor more details please visit the Conference website at http://tsp.vutbr.cz/?page_id=2744#SS1-17.EDITORIAL BOARD:- Prof. Dan Popescu - University Politehnica of Bucharest, Romania (Editor-in-Chief) (E-mail: firstname.lastname@example.org)- Dr. Loretta Ichim - University Politehnica of Bucharest, Romania (E-mail: email@example.com) STUDENT BEST PAPER AWARD:In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, to recognize outstanding technical contributions by students, as evidenced by the quality of papers, their presentations, and their technical excellence, the authors of the Best 3 Student Papers will be awarded during the conference by the Technical Committee. The Best Student Paper Award consists in a Certificate of Appreciation Plaque and an IEEE Student or IEEE Graduate Student membership for 2018. CONFERENCE ORGANIZERS: The TSP 2017 is IEEE technically co-sponsored Conference organized in cooperation with sixteen universities: - Brno University of Technology, Department of Telecommunications, Brno, Czech Republic- Budapest University of Technology and Economics, Department of Telecommunications and Media Informatics, Budapest, Hungary- Czech Technical University in Prague, Department of Telecommunication Engineering, Prague, Czech Republic- Isik University, Department of Electrical and Electronics Engineering, Sile/Istanbul, Turkey- Istanbul Technical University, Electronics and Communication Engineering Department, Istanbul, Turkey- Karadeniz Technical University, Department of Electrical and Electronics Engineering, Trabzon, Turkey- National Taiwan University of Science and Technology, Department of Electronic and Computer Engineering, Taipei, Taiwan- Seikei University, Graduate School and Faculty of Science and Technology, Information Networking Laboratory, Tokyo, Japan- Slovak University of Technology, Institute of Telecommunications, Bratislava, Slovak Republic- Tecnocampus, Escola Universitaria Politecnica de Mataro, Mataro, Spain- Technical University of Sofia, Faculty of Telecommunications, Sofia, Bulgaria- Universite Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancee de Saint-Denis (LIASD), France- University of Ljubljana, Laboratory for Telecommunications, Ljubljana, Slovenia- University of Osijek, Faculty of Electrical Engineering, Computer Science and Information Technology Osijek, Croatia- VSB - Technical University of Ostrava, Department of Telecommunications, Ostrava, Czech Republic- West Pomeranian University of Technology, Faculty of Electrical Engineering, Szczecin, PolandIMPORTANT DATES:Full Paper Submission: March 14, 2017 - 2PM CET (Final Extended Deadline)Notification of Paper Acceptance: April 14, 2017 Final Paper Submission: April 28, 2017 Authors' Early Registration and Payment: May 14, 2017 Authors' Late Registration and Payment: May 24, 2017 Listeners' Registration: July 5, 2017CONTACTS: Web: http://tsp.vutbr.cz/ E-mail: firstname.lastname@example.org Follow us on:- Facebook https://www.facebook.com/tspconf - Twitter https://twitter.com/tspconf TSP Organizers reserve the right to exclude a paper from distribution after the Conference (e.g., non-indexing in IEEE Xplore® and other databases) if the paper is not presented at the Conference. However, this paper will be distributed as part of the Conference proceedings issued on an USB drive.
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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