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ICESS 2017 - The Third International Conference on Electronics and Software Science (ICESS2017)

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Website http://sdiwc.net/conferences/3rd-international-electronics-software-science/ | Edit Freely

Category computer science, computer engineering, electronics, software engineering

Deadline: June 30, 2017 | Date: July 31, 2017-August 02, 2017

Venue/Country: Takamatsu Sunport Hall Building, Takamatsu, Japan, Japan

Updated: 2017-01-21 01:27:49 (GMT+9)

Call For Papers - CFP

The Third International Conference on Electronics and Software Science (ICESS2017)

http://sdiwc.net/conferences/3rd-international-electronics-software-science/

Takamatsu Sunport Hall Building, Takamatsu, Japan

July 31 - August 2, 2017

The conference aims to enable researchers to build connections between different digital applications.

The conference welcome papers on the following (but not limited to) research topics:

- Advanced Power System and Control System

- Analog and digital circuit Design

- Automobile Engineering

- Broad Band Communication

- Communication Computer and Intelligent Communication

- Control and Robotics

- Disaster Prevention Engineering

- e-Healthcare System

- Electromagnetics and Photonics

- Ergonomics and Application

- Expert Systems and Artificial Intelligence Techniques

- Feedback Control Systems

- High Voltage Engineering

- Information systems and network security

- Kansei Engineering

- Measurements and Instrumentation

- Mechatronics and Avionics

- Medical Engineering

- Nano Devices and Integrated Systems

- Non Conventional Energy Resources

- Optical Networks & communication

- Power Electronics

- Power Electronics & Electric Drives

- Power Electronics and Energy Efficient Drives

- Power Quality Improvement Techniques

- Power Systems

- Processing and Multimedia, Biomedical Imaging

- Remote sensing and satellite communication

- RF and Microwave Engineering

- Sensor technology & Virtual Instrumentation

- Server Virtualization Technology

- Soft Computing Techniques in Power Systems

- Software for Life Science

- Software for Material Science

- System Modeling & Simulation

- Systems Science and Signal Processing

- VLSI technology & Design

- Affective Computing

IMPORTANT DATES:

Submission Deadline: Open from now until June 30, 2017

Notification of Acceptance: 4-7 weeks from the Submission Date

Camera Ready Submission: July 21, 2017

Registration Deadline: July 21, 2017

Conference Dates: July 31 – August 2, 2017


Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.