ICESS 2017 - The Third International Conference on Electronics and Software Science (ICESS2017)
Website http://sdiwc.net/conferences/3rd-international-electronics-software-science/ |
Category computer science, computer engineering, electronics, software engineering
Deadline: June 30, 2017 | Date: July 31, 2017-August 02, 2017
Venue/Country: Takamatsu Sunport Hall Building, Takamatsu, Japan, Japan
Updated: 2017-01-21 01:27:49 (GMT+9)
Call For Papers - CFPThe Third International Conference on Electronics and Software Science (ICESS2017) http://sdiwc.net/conferences/3rd-international-electronics-software-science/Takamatsu Sunport Hall Building, Takamatsu, JapanJuly 31 - August 2, 2017The conference aims to enable researchers to build connections between different digital applications.The conference welcome papers on the following (but not limited to) research topics:- Advanced Power System and Control System - Analog and digital circuit Design- Automobile Engineering - Broad Band Communication- Communication Computer and Intelligent Communication- Control and Robotics - Disaster Prevention Engineering- e-Healthcare System - Electromagnetics and Photonics- Ergonomics and Application- Expert Systems and Artificial Intelligence Techniques- Feedback Control Systems - High Voltage Engineering- Information systems and network security- Kansei Engineering- Measurements and Instrumentation - Mechatronics and Avionics- Medical Engineering - Nano Devices and Integrated Systems- Non Conventional Energy Resources - Optical Networks & communication- Power Electronics - Power Electronics & Electric Drives- Power Electronics and Energy Efficient Drives - Power Quality Improvement Techniques- Power Systems - Processing and Multimedia, Biomedical Imaging- Remote sensing and satellite communication - RF and Microwave Engineering- Sensor technology & Virtual Instrumentation - Server Virtualization Technology- Soft Computing Techniques in Power Systems - Software for Life Science- Software for Material Science - System Modeling & Simulation- Systems Science and Signal Processing - VLSI technology & Design- Affective Computing IMPORTANT DATES:Submission Deadline: Open from now until June 30, 2017Notification of Acceptance: 4-7 weeks from the Submission DateCamera Ready Submission: July 21, 2017Registration Deadline: July 21, 2017Conference Dates: July 31 – August 2, 2017
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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