Sign for Notice Everyday    Sign Up| Sign In| Link|

Our Sponsors

Receive Latest News

Feedburner
Share Us

ISLPED 2017 - IEEE/ACM INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN (ISLPED)

View: 241

Website http://www.islped.org | Edit Freely

Category ISLPED 2017

Deadline: March 06, 2017 | Date: July 24, 2017-July 26, 2017

Venue/Country: Taipe, Taiwan

Updated: 2016-12-18 12:13:36 (GMT+9)

Call For Papers - CFP

p/>CALL FOR PAPERS - ISLPED 2017 (http://www.islped.org
)

IEEE/ACM INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN

Location: Taipei, Taiwan

Date: July 24-26, 2017

Abstract registration by Feb 27, 2017, at 11:59pm Pacific Standard Time Full paper due by Mar 6, 2017, at 11:59pm Pacific Standard Time

Notification of paper acceptance: May 3, 2017

Camera-ready version due: June 1, 2017

The International Symposium on Low Power Electronics and Design (ISLPED) is the premier forum for presentation of innovative research in all aspects of low power electronics and design, ranging from process technologies and analog/digital circuits, simulation and synthesis tools, system-level design and optimization, to system software and applications. Specific topics include, but are not limited to, the following three main tracks and sub-areas:

1. Technology, Circuits, and Architecture

1.1. Technologies

1.2. Circuits

1.3. Logic and Architecture

2. CAD, system, and software

2.1. CAD Tools and Methodologies

2.2. Systems and Platforms

2.3. Software and Applications

3. Industrial Design Track

Submissions should be full-length papers of up to 6 pages (PDF format, double-column, US letter size, using the ACM Conference format, available at http://www.acm.org/publications/article-templates/proceedings-template.html including all illustrations, tables, references, and an abstract of no more than 250 words. Submissions must be anonymous. Submissions exceeding 6 pages or identifying the authors, either directly or through explicit references to their prior work, will be automatically rejected. More information about paper submission can be found at http://www.islped.org.

ORGANIZING COMMITTEE:

General Co-Chairs

Chia-Lin Yang, NTU

yangc@csie.ntu.edu.tw

David Garrett, Broadcom

garrettd@broadcom.com

Program Co-Chairs

Thomas Wenisch, Univ. Michigan

twenisch@umich.edu

Jaydeep Kulkarni, Intel

jaydeep.p.kulkarni@intel.com

Publicity Co-Chairs

Jae-Joon Kim, POSTECH

jaejoon@postech.ac.kr

Umit Ogras, ASU

umit@asu.edu

Treasurer

Yi-Jung Chen, NCNU

yjchen@ncnu.edu.tw

Web Chair

Hsiang-Yun Cheng, Sinica

hycheng@citi.sinica.edu.tw

Industry Liaisons

John Redmond, Broadcom

jcredmon@broadcom.com

Tai-Cheng Lee, NTU

tlee@ntu.edu.tw

Tsung-Yi Ho, NTHU

tyho@cs.nthu.edu.tw

Publication Chair

Iris Hui-Ru Jiang, NCTU

huiru.jiang@gmail.com

Local Arrangement Co-Chairs

Pi-Cheng Hsiu, Sinica

pchsiu@iis.sinica.edu.tw

Yuan-Hao Chang, Sinica

johnson@iis.sinica.edu.tw

Registration Chair

Tsung-Te Liu, NTU

ttliu@ntu.edu.tw

Design Contest Co-Chairs

Saibal Mukhopadhyay, Georgia Tech

saibal@ece.gatech.edu

Yongpan Liu, NTHU

ypliu@tsinghua.edu.cn


Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.