ICDEPI 2017 - 2017 International Conference on Design Engineering and Product Innovation (ICDEPI 2017)
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Website http://www.icdepi.org |
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Category Technology and Engineering
Deadline: June 10, 2017 | Date: July 12, 2017-July 14, 2017
Venue/Country: Singapore
Updated: 2017-02-10 18:08:39 (GMT+9)
Call For Papers - CFP
Welcome to 2017 International Conference on Design Engineering and Product Innovation (ICDEPI 2017). ICDEPI 2017 is organized by Hong Kong Society of Mechanical Engineers (HKSME), technical sponsored by Nanyang Technological University(NTU), Hong Kong Polytechnic University. The conference will be held at Nanyang Technological University(NTU), Singapore, from Jul. 12-14, 2017!●Publication and Indexing 1, Publishing in the Conference Proceeding.All papers of ICDEPI 2017 will be published in the conference proceeding, which will be indexed by SCOPUS, Ei Compendex and other academic databases.2, Publishing in International Journals.Selected excellent papers with extension will be recommended to be published in the jounral.●Confirmed Speakers: 1. Prof. Cees de Bont:Affiliation: Hong Kong Polytechnic University, Hong Kong2. Prof. Lucienne Blessing: Affiliation: Singapore University of Technology and Design, Singapore3. Prof. David Dornfeld:Affiliation: Lab for Manufacturing and Sustainability (LMAS), USA●Committee:1. Conference Chairman* Prof. Cees de Bont, Hong Kong Polytechnic University, Hong Kong* Prof. Lucienne Blessing, Singapore University of Technology and Design, Singapore2.International Technical Committee*Prof. David Dornfeld, Lab for Manufacturing and Sustainability (LMAS), USA*Prof. Dantan Jean-yves, Universités chez ENSAM, France*Prof. Stefan Dimov, University of Birmingham, UKMore is to be added……●Topics of interest for submission include, but are not limited to:Design ProcessesDesign Theory and Research MethodologyDesign Organization and ManagementProduct, Service and Systems DesignDesign Information and KnowledgeHuman Behavior in DesignDesign EducationDesign Methods and ToolsMachinery and Machine DesignProduct Development and DesignProduct Process Design and ManagementProduct Quality ManagementIntelligent ProductProduct Exploitation Origination InnovationProduct Structure Innovation●Paper Submission1, Papers can be submitted as PDF via EasyChair: http://www.easychair.org/conferences/?conf=icdepi20172, You can also choose to submit your paper directly to icdepismehk.org3, Contributions must be written in English and report on original, unpublished work not submitted for publication elsewhere. Submissions not adhering to the above specified constraints may be rejected without review. ●CONTACT USMs. Amber CaoEmail: icdepismehk.orgWebsite: http://www.icdepi.org
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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