Sign for Notice Everyday    Sign Up| Sign In| Link| English|

Our Sponsors

    Receive Latest News

    Feedburner
    Share Us


    ICDEPI 2017 - 2017 International Conference on Design Engineering and Product Innovation (ICDEPI 2017)

    View: 1024

    Website http://www.icdepi.org | Want to Edit it Edit Freely

    Category Technology and Engineering

    Deadline: June 10, 2017 | Date: July 12, 2017-July 14, 2017

    Venue/Country: Singapore

    Updated: 2017-02-10 18:08:39 (GMT+9)

    Call For Papers - CFP

    Welcome to 2017 International Conference on Design Engineering and Product Innovation (ICDEPI 2017). ICDEPI 2017 is organized by Hong Kong Society of Mechanical Engineers (HKSME), technical sponsored by Nanyang Technological University(NTU), Hong Kong Polytechnic University. The conference will be held at Nanyang Technological University(NTU), Singapore, from Jul. 12-14, 2017!

    ●Publication and Indexing

    1, Publishing in the Conference Proceeding.

    All papers of ICDEPI 2017 will be published in the conference proceeding, which will be indexed by SCOPUS, Ei Compendex and other academic databases.

    2, Publishing in International Journals.

    Selected excellent papers with extension will be recommended to be published in the jounral.

    ●Confirmed Speakers:

    1. Prof. Cees de Bont:

    Affiliation: Hong Kong Polytechnic University, Hong Kong

    2. Prof. Lucienne Blessing:

    Affiliation: Singapore University of Technology and Design, Singapore

    3. Prof. David Dornfeld:

    Affiliation: Lab for Manufacturing and Sustainability (LMAS), USA

    ●Committee:

    1. Conference Chairman

    * Prof. Cees de Bont, Hong Kong Polytechnic University, Hong Kong

    * Prof. Lucienne Blessing, Singapore University of Technology and Design, Singapore

    2.International Technical Committee

    *Prof. David Dornfeld, Lab for Manufacturing and Sustainability (LMAS), USA

    *Prof. Dantan Jean-yves, Universités chez ENSAM, France

    *Prof. Stefan Dimov, University of Birmingham, UK

    More is to be added……

    ●Topics of interest for submission include, but are not limited to:

    Design Processes

    Design Theory and Research Methodology

    Design Organization and Management

    Product, Service and Systems Design

    Design Information and Knowledge

    Human Behavior in Design

    Design Education

    Design Methods and Tools

    Machinery and Machine Design

    Product Development and Design

    Product Process Design and Management

    Product Quality Management

    Intelligent Product

    Product Exploitation Origination Innovation

    Product Structure Innovation

    ●Paper Submission

    1, Papers can be submitted as PDF via EasyChair:

    http://www.easychair.org/conferences/?conf=icdepi2017

    2, You can also choose to submit your paper directly to icdepiatsmehk.org

    3, Contributions must be written in English and report on original, unpublished work not submitted for publication elsewhere. Submissions not adhering to the above specified constraints may be rejected without review.

    ●CONTACT US

    Ms. Amber Cao

    Email: icdepiatsmehk.org

    Website: http://www.icdepi.org


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.