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EECEA 2017 - The Fourth International Conference on Electrical, Electronics, Computer Engineering and their Applications (EECEA2017)

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Website http://sdiwc.net/conferences/4th-international-conference-electrical-electronics-computer-engineerin | Edit Freely

Category Electronics Engineering; Electrical Engineering; Computer Engineering; Data Compression

Deadline: September 11, 2017 | Date: October 11, 2017-October 13, 2017

Venue/Country: University of Perpetual Help System DALTA, Las Piñ, Philippines

Updated: 2016-10-13 10:40:01 (GMT+9)

Call For Papers - CFP

The Fourth International Conference on Electrical, Electronics, Computer Engineering and their Applications (EECEA2017)

University of Perpetual Help System DALTA, Las Piñas, Manila, Philippines

October 11-13, 2017

URL: http://sdiwc.net/conferences/4th-international-conference-electrical-electronics-computer-engineering-their-applications/

Email: eecea17@sdiwc.net

The conference aims to bring together researchers from different countries to present their research works involving various and such topics related to the scope of this conference. All registered papers will be published in SDIWC Digital Library, CD Proceedings and will be sent for inclusion in some indexing sites and databases. BEST papers will be published in one of the following special issues provided that the author do major improvements and extension within the time frame that will be set by the conference and his/her paper is approved by the chief editor:

- International Journal of New Computer Architectures and their Applications (IJNCAA); eISSN 2220-9085, pISSN 2412-3587

- International Journal of Cyber-Security and Digital Forensics (IJCSDF); eISSN 2225-658X, pISSN 2412-6551

- International Journal of Digital Information and Wireless Communications (IJDIWC); eISSN 2305-0012

- International Journal of E-Learning and Educational Technologies in the Digital Media (IJEETDM); eISSN 2410-0439

The conference welcomes papers on the following (but not limited to) research topics:

*Electronics Engineering

3D Semiconductor Device Technology

Advanced Electromagnetics

Component Technology of MEMS

Computer Engineering

Electronics System-Level Based Design

Electronics-Medical Electronics

Adaptive Signal Processing

Artificial Intelligence

Compound Semiconductor Physics and Devices

Device Electronics for I.C

Electronics & Nano Electronics

*Electrical Engineering

Software Specification

Analysis of Power Quality and System Stability

Analog Circuits and Digital Circuits

Battery Management System

Computer Relaying

Electromagnetic and Photonics

Software Assurance

Assembly and Packaging

Antenna and Propagation

Circuits and Electronics

Electric Energy Processing

Electro-optical Phenomena of Semiconductors

*Computer Engineering

Algorithms

Automated Software Engineering

Computer-aided Design

Computer Architecture

Computer Modeling

Computer Security

Database and Data Mining

Data Encryption

Artificial Intelligence

Bioinformatics and Scientific Computing

Computer Animation

Computing Ethics

Computer Networks

Computer Simulation

Data Compression

Researchers are encouraged to submit their work electronically. All papers will be fully refereed by a minimum of two specialized referees. Before final acceptance, all referees comments must be considered.

Important Dates

Submission Deadline: September 11, 2017

Notification of Acceptance: September 21, 2017 or 4 weeks from the submission date

Camera Ready Submission: September 30, 2017

Registration Deadline: September 30, 2017

Conference Dates: October 11-13, 2017


Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.